For Wafer Dicing Application | Blade
Clean Dice is designed specifically for the semiconductor industry. It is a surfactant additive mixed along with D.I. water to improve lubricity and cooling as well as removing particles and corrosion.
Features
Excellent Cooling Capability
Lower-Force Probes
Large Compliance Windows
Reduces Loads being excessively pushed unto Saw Blades
Large Compliance Windows
Excellent Wafer Cleaning Agent
Cost Effective