SEMES

The Semiconductor Division produces cleaning, phototrack, and etch equipment, the core equipment for the front-end process.

Product Line Up

Home / SEMES / Toyo Adtec Asia Pacific

TEPAS (Sorter)

Features
  • Applicable PKG : FBGA, CSP, MCP, FLIP CHIP and QFN High throughput and stability (45,000 UPH)
  • Process : Dead to Live, Dead to Dead available
  • Larger strip size (300mm x 120mm, 260mm x 200mm available)
  • Tray placement rate : 100% (RCPM)
  • Enhanced cleaning system (PVA and Bubble Jet)
  • Intelligent real-time monitoring system

    • Product Line Up

    Home / SEMES / Toyo Adtec Asia Pacific

    TEPAS (Sorter)

    Features
  • Applicable PKG : FBGA, CSP, MCP, FLIP CHIP and QFN High throughput and stability (45,000 UPH)
  • Process : Dead to Live, Dead to Dead available
  • Larger strip size (300mm x 120mm, 260mm x 200mm available)
  • Tray placement rate : 100% (RCPM)
  • Enhanced cleaning system (PVA and Bubble Jet)
  • Intelligent real-time monitoring system

    • SW 6000 Plus Sorter

    Features
  • Applicable PKG : FBGA, CSP, MCP, FLIP CHIP and QFN
  • High throughput (25,000 UPH)
  • Process : From dead bug (Ball up) to live bug (Ball down offloading)
  • Vision inspection : orientation, ball, mark, PKG align and side vision (optional)
  • Tray placement rate : 100% (RCPM)
  • Easy conversion and maintenance
  • Enhanced cleaning system (PVA and Bubble Jet)

    • Address: Toyo Adtec Pte Ltd 24 Sin Ming Lane #04-99 Midview CitySingapore 573970
    • Phone: + (65) 701 368
    • Fax: + (65) 701 369

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