Wafer Dicing Tape is a critical component in the production of semiconductor or PCB devices. By choosing the right dicing tape for your application, we can help to ensure the quality and reliability of your products.
Backgrind tape is a critical component in the backgrinding process. By choosing the right backgrind tape for your application, you can help to ensure the quality and reliability of your wafers.
This is protection tape for circuit of semiconductor wafer surface in back grinding process.
Toyo Adtec's Heat Release Film is applicable to temporarily fixing semiconductor and PCB chips, LCD touch screen glasses, LED, MLCC substrates for cutting, grinding, ceramic and other operaions with needs in fixing objects for further processing. The tape is easily peeled off or released by heat above certain temperature depending on product type.
Toyo Adtec's Polyimide Film are Ideal for applications requiring high dielectric strength in extreme temperature environments, polyimide pressure sensitive adhesive tapes boast resistance to extreme heat, solvents and abrasion. Our full portfolio of polyimide tapes include DuPont® Kapton® coated with acrylic or silicone adhesive and cling film options, all of which are designed for high temperature electrical applications.