Dicing | Singulation Tape

NON UV | UV Type Films

Wafer Dicing Tape is a critical component in the production of semiconductor or PCB devices. By choosing the right dicing tape for your application, we can help to ensure the quality and reliability of your products.

Features

Excellent Chipping Property

Our dicing tape can properly hold silicon wafer,resin substrate,and other kinds of adhered,and offer clear cut line to you.

Excellent pick up property

Our dicing tape can pick up thin wafer ,and can be use for the most advanced application.

"Low contamination" of the surface and the side of wafer or resin substrate.

The Contamination is little after dicing or peeling our Dicing Tape.

Your Options

NON UV or UV Type

Precut | Roll Type (Custom Sizes Available)

Standard or Antistatic

Back Grinding Tape

NON UV | UV Type Films

Backgrind tape is a critical component in the backgrinding process. By choosing the right backgrind tape for your application, you can help to ensure the quality and reliability of your wafers.
This is protection tape for circuit of semiconductor wafer surface in back grinding process.

Features

Suitable for thin wafer grinding

Good for Detaping

Suitable for various device

Your Options

NON UV or UV Type

Precut | Roll Type (Custom Sizes Available)

Standard or Antistatic

Heat Release Film

NON UV | UV Type Films

Toyo Adtec's Heat Release Film is applicable to temporarily fixing semiconductor and PCB chips, LCD touch screen glasses, LED, MLCC substrates for cutting, grinding, ceramic and other operaions with needs in fixing objects for further processing. The tape is easily peeled off or released by heat above certain temperature depending on product type.

Features

Strong Adhesion at Room Temperature

Release by Heat

Cost Effective

No Contamination

Your Options

Wide Variety of Backing Thickness

Precut | Roll Type (Custom Sizes Available)

Custom Adhesion Strength

Heat Release Film

NON UV | UV Type Films

Toyo Adtec's Polyimide Film are Ideal for applications requiring high dielectric strength in extreme temperature environments, polyimide pressure sensitive adhesive tapes boast resistance to extreme heat, solvents and abrasion. Our full portfolio of polyimide tapes include DuPont® Kapton® coated with acrylic or silicone adhesive and cling film options, all of which are designed for high temperature electrical applications.

Features

Flame Retardant

High Temperature Resistance

Full Polyimide Coating

No Contamination

Your Options

Wide Variety of Backing Thickness and Width 

Precut | Roll Type (Custom Sizes Available)

Custom Adhesion Strength