Macdermid alpha chemicals
A Global Diversified Specialty Chemicals Company
Products and Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands provide solutions that power electronics interconnection.
Process Chemistry for PCB and Semiconductor Industry
| Product Description | Product Offered | Product Model |
|---|---|---|
| Our Immersion Tin Processes represent the pinnacle of trusted reliability for tin metal final finishes in the automotive electronics segment and beyond. |
Organic Metal-Based Immersion Tin Processes |
ORMECON CSN |
| It offers a chemically stable, low foaming and efficient application process that delivers excellent Pb-free solderability and an extremely planar surface. MacStan HSR 3.0 is the immersion tin plating process designed specifically to inhibit whisker formation and deliver a tin deposit with an extended shelf life of up to 12 months. | MacStan HSR 3.0 is the immersion tin plating process designed specifically to inhibit whisker formation and deliver a tin deposit with an extended shelf life of up to 12 months. |
MacStan HSR 3.0 |
| Copper Adhesion Promotion | PackageBond is the no-risk adhesion promotion system specifically engineered for reliability for today’s intense lead-free circuit assembly temperatures. |
Packagebond HT-U |
| Industry standard resist strippers, developers, innerlayer cleaners, and dry film resists. | high-performance Photoresist Strippers. |
RS-999 |
| Effective descaling and anti-scumming additives plus the ease of handling a pure liquid concentrate. The Developer 40 contains no suspended particles, reducing clogging and wear of the apparatus compared to solid carbonate. | Highly Concentrated Aqueous Photoresist developer solutions, making feed-and-bleed control of the developer solution simple and consistent. |
Developer 45 Plus |
Liquid, silicone-free anti-foam agent specifically engineered for spray Developer and Resist Strip applications. |
MacDermid AF (Antifoam |
|
| High speed, moderate capacity, continuous alkaline etchant system used in the manufacture of fine line printed circuit boards. It will remove capper at an etch rate of 2.0 -2.5 mils per mlnute at 125F (52"C), and can dissolve and hokl copper in solution in the range of 12 to 18 oz/gal(90 to 135 gm/L). | Fine Line Alkaline Etch |
Ultra Etch FL |
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- Phone: + (65) 701 368
- Fax: + (65) 701 369
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