Resopower® Dryfilm Photoresist for PCB Architecture
The Resopower® lineup represents the next tier in premium photomechanical imaging solutions engineered explicitly for advanced Printed Circuit Board (PCB) lithography. Designed to meet the demanding parameters of high-density interconnects (HDI) and micro-fine tracing circuits, these films offer unrivaled chemical consistency and production reliability across automated lamination processing arrays.
Resopower® Matrix
Engineered for state-of-the-art HDI inner and outer layer pattern transfers. Features ultra-high sensitivity properties perfectly adapted for high-throughput Laser Direct Imaging (LDI) lines and modern UV-LED DI exposure technologies.
Formulated specifically to ensure total dimensional reliability across outer-layer plated-through-hole (PTH) tenting configurations, pattern plating chemistry cycles, and aggressive acid copper chemical etching paths.
Optimized chemical elasticity crafted to conform precisely to the physical flexing profiles and tight layout parameters of flexible substrates. Built to remain resilient throughout fine-line pattern processing runs.
Targeted photopolymer configurations designed to optimize processing windows inside specialized industrial environments.
MU Negative Series
Negative-working film optimized for quick-turn prototyping and high-contrast commercial production runs.
IC Substrate Film
Micro-resolution chemistry engineered for fine-pitch IC semiconductor packaging and modified semi-additive (mSAP) processes.
Glass-Based Film
Unique adhesion properties balanced specifically for high-strength transfer applications on flat glass display surfaces.