Opto Intel Plasma Cleaning Machine
The Opto Intel Plasma Cleaning Machine is an advanced, ultra-precise surface treatment system designed to achieve microscopic purity and optimize surface energy prior to critical downstream processing. Utilizing low-temperature, high-efficiency gas plasma technology, the system effectively removes organic contaminants, micro-residues, and thin oxide layers at the molecular level without altering the bulk properties of delicate substrates.
Engineered for high-reliability manufacturing sectors—including semiconductor packaging, optoelectronics, medical devices, and automotive electronics—this system serves as an essential pre-treatment phase. By altering the chemical topography of the material, it dramatically enhances surface wettability, ensuring flawless wire bonding, die attachment, micro-fluidic sealing, and thin-film deposition while substantially maximizing final production yields.
Zhongke Guangzhi (Opto-Intel) Process Solutions
High-precision advanced semiconductor packaging, surface treatment, and void-free soldering systems engineered for maximum yield.
Microwave Plasma Cleaning Systems
Series: WBDLZQXJGenerates high-density, completely uniform isotropic radicals using an electrode-free discharge matrix. Eliminates sputtering contamination and minimizes thermal stress on sensitive substrates.
Core Capabilities
- Isotropic, high-density radical generation
- Electrode-free setup preventing metal sputtering
- Ultra-low thermal load on processed substrates
Target Applications
- Pre-wire bonding surface preparation
- Flip-chip underfill adhesion enhancement
- Photoresist ash and residue cleaning
RF Plasma Cleaning Systems
Series: EMP High-Frequency LineEngineered for directional ion bombardment (anisotropic etching). Highly effective at removing persistent native oxide layers on metallic leadframes before critical packaging phases.
Core Capabilities
- Anisotropic etching via directional bombardment
- Highly effective metallic oxide reduction
- Flexible multi-tray configuration presets
Target Applications
- Leadframe surface de-oxidation
- Pre-molding compound plastic activation
- Optoelectronic device structural cleaning
Precision Die Bonder Systems
Series: ND Placement ModuleUltra-fast micro-component pick and place platform. Features robust support setups for advanced packaging methodologies including eutectic heating, epoxy gluing, and flip-chip attach mechanisms.
Core Capabilities
- Sub-micron level placement precision
- Eutectic, epoxy, and flip-chip mode compatibility
- High-speed vision-guided sorting alignment
Target Applications
- High-power LED submount assembly
- MEMS & IC cleanroom packing loops
- Laser diode and transceiver array alignment
Vacuum Solder Reflow Ovens
Series: VSR Dynamic AtmosphereProvides a completely sealed vacuum reflow processing zone capable of driving structural joint voids down to less than 1%. Features active formic acid gas controls for immaculate oxidation control.
Core Capabilities
- Achieves ultra-low internal voids (≤ 1%)
- Formic acid (HCOOH) and Nitrogen process control
- Multi-zone programmable thermal profiling
Target Applications
- IGBT high-reliability power modules
- Hermetic lid sealing and wafer-scale reflow
- Automotive-grade electronic assembly
Silver Sintering Systems
Series: SMT Sintering PressState-of-the-art thermal compression system allowing for high-pressure or pressureless silver sintering. Provides an absolute premium thermal interface ideal for high-power wide-bandgap chipsets.
Core Capabilities
- High-pressure and pressureless adaptive profiles
- PPM level real-time oxygen monitoring
- Highly uniform thermal-die compression matrix
Target Applications
- Wide-bandgap chips (SiC and GaN modules)
- Electric Vehicle (EV) drive-inverter assembly
- RF High-Frequency power amplifier setups
Our Semiconductor and PCB Films
Various Applications and Customizations
Singulation Tape
Secures Chips During cutting; Offers precise UV release.
Backgrinding Film
Supports wafers during thinning; prevents breakage.
Heat Release Film
Supports package dicing; prevents breakage and residue Free.
Precision Pre-Cut Dicing Films
Zero Airborne Contam and Perfect Frame Alignment Fit to customer needs.
Backgrind Tapes
Supports wafers during thinning; prevents breakage.
Polyimide Film
Paired with high-performance silicone or acrylic adhesives, it peels away perfectly clean after processing, leaving zero residue on precious gold contacts.