Brown Oxide Treatment (BOT) for Leadframes
Eliminate package delamination and elevate reliability. Our high-precision Chemical Treatment introduces controlled micro-roughening to guarantee maximum mechanical and chemical interlocking between copper leadframes and epoxy molding compounds (EMC).
Zero Delamination
Our process uses precise, intergranular acid-etching to build microscopic "teeth" across the copper surface, ensuring robust mechanical locking with your encapsulant resins.
JEDEC MSL-1 Compliance
Drastically reduces moisture ingress along structural metal-plastic interfaces. Protects your IC packages from destructive "popcorn cracking" during high-temp operations.
260°C Reflow Stability
Engineered with a uniform, specialized organometallic copper oxide layer that maintains superior chemical bond integrity during lead-free solder reflow profiles.
| Technical Focus | Our Engineered Solution |
|---|---|
| Selective Single-Sided Masking | We protect critical wire-bonding and down-bond regions (such as silver/gold plated zones) from oxide film deposition, guaranteeing uncompromised wire-bond pull strength and ball-stitch integrity. |
| Epoxy Bleed-Out (EBO) Control | By managing surface micro-topography variations and optimizing surface energy, our treatment minimizes capillary pull, stopping liquid resin bleed-out from die-attach adhesives. |
| Uniform Film Morphology | Utilizes state-of-the-art inline chemical bath replenishment systems with organic heterocyclic additives to ensure ultra-consistent micro-roughness distribution across high-density leadframes. |
Process Reliability & Yield Estimate Calculator
Enter your current production metrics below to evaluate how our BOT optimizations target and improve your standard assembly yields.
Estimated Retained Units / Month
Upgrade Your Packaging Quality
Talk to our semiconductor process engineers today to receive sample processing data or request a custom validation run for your proprietary leadframe designs.
Request Process SpecificationsOur Semiconductor and PCB Films
Various Application and Customizations
Singulation Tape
Secures Chips During cutting; Offers precise UV release.
Backgrinding Film
Supports wafers during thinning; prevents breakage.
Heat Release Film
Supports package dicing; prevents breakage and residue Free.
Toyo Adtec Precision Pre-Cut Dicing Films: Streamline Your Singulation Process
Zero Airborne Contam andPerfect Frame Alignment Fit to customer needs.
Backgrind Tapes
Supports wafers during thinning; prevents breakage.
Polyimide Film
Paired with high-performance silicone or acrylic adhesives, it peels away perfectly clean after processing, leaving zero residue on precious gold contacts ("gold fingers").
Mylar Carrier Film
The ceramic dielectric slurry is coated directly onto the moving PET film via a doctor blade or die coater. The film must be completely uniform to prevent thickness variations with custom Length and Width per custoner needs,
Die Attach Film
Die Attach Film is adhesive film which is used for semiconductor process. Optimized dicing tape for Die Attach Film achieves excellent pick up performance