High-Performance Advanced Ceramic Capillaries
Crafted from modified nano-alumina powder utilizing advanced forming technology and specialized sintering processes, our ceramic capillaries deliver high density, exceptional hardness, superior wear resistance, and outstanding chemical stability. Designed with precision end-face surface roughening treatments, they optimize wire grip, ensure stable bonding consistency, and deliver extended operational lifespan across automated semiconductor wire bonders such as K&S and ASM.
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| Surface Classification | Series Identifier | Micro Morphology Features | Primary Wire Bonding Application |
|---|---|---|---|
| E/G Particle Surface | HAC-EG Series | Fine nano-alumina particle textured end face | Gold (Au) wire, fine-pitch IC packaging |
| Grid Surface | GS Series | Engineered cross-hatch micro-groove matrix | Alloy wire and copper wire bonding |
| B/D Particle Surface | BD Series | High-density abrasive matte finish structure | Pure copper wire bonding, high-reliability modules |
| Smooth Polished Surface | STD Series | Mirror-finish smooth flat or recessed tip face | General-purpose standard semiconductor wire bonding |
Advanced Nano-Alumina
Manufactured from modified nano-alumina raw powders using high-precision forming and sintering processes, delivering maximum hardness and structural uniformity.
Optimized Wire Grip
Specialized end-face surface roughening technologies significantly enhance gripping friction against bonding wires, preventing loop defects and tail slip.
Equipment Compatibility
Fully certified and widely adopted across international semiconductor packaging lines, serving as a trusted long-term partner for K&S and ASM bonder operators.
Rapid Customization
Flexible in-house manufacturing in Shenzhen enables prompt parameter adjustments, rapid prototype delivery, and tailored custom capillary geometries.