Superabrasive Diamond Grinding Wheels
A precision engineering architecture matching chemical bonding matrices with high-hardness materials like Tungsten Carbide, Advanced Ceramics, and PCD/PCBN tooling profiles.
■ Mechanical Matrix Selector
Engineered Configuration Profile:
Resin Bond Core System
Recommended Concentration: 50% - 75% Volumetric
Optimal Mesh/Grit Size: #400 to #600 (Fine Scale)
■ Wheel Architecture Anatomy (Type 1A1)
Diamond Abrasive Rim (Layer Depth X)
Transition Layer / Layer Boundary
Support Matrix Core (Steel / Aluminum)
Arbor Mounting Bore (H)
■ Superabrasive Bond Classification Matrix
| Bond Classification | Core Mechanical Strengths | Recommended Concentration | Primary Field Applications |
|---|---|---|---|
| Resin Bond | Excellent elastic resilience, superior self-sharpening properties, very low process heat tracking | 50% — 75% | Sharpening, semi-finishing, and mirror polishing of tungsten carbide tools, endmills, and cutters. |
| Vitrified Bond | High micro-porosity for optimum cooling, superb dressing capabilities, minimized structural friction expansion | 75% — 100% | Highly demanding automated production of PCD/PCBN indexable inserts and ultra-hard sintered matrices. |
| Extreme structural rigidity, long lifecycle scale, unmatched profile shape retention qualities | 100% — 150% | Rough grinding and deep layout slot molding of glass panels, quartz crystals, and industrial ceramics. | |
| Electroplated | Maximum abrasive diamond exposure density, high localized cutting aggression, zero dressing required | Single Layer | Complicated geometrical profile wheels, custom internal grinding pins, and rapid-speed machining arrays. |
Application Map
- Coarse Grinding: Rapid material removal for back-side thinning of pristine silicon ingots and sliced substrates.
- Fine Grinding / Pre-Polishing: Eliminating processing marks, micro-stress boundaries, and flattening TTV prior to chemical mechanical planarization (CMP).
- Advanced Materials Handling: Custom configurations perfectly tailored to high-hardness substrates like Silicon Carbide (SiC) and Gallium Nitride (GaN).