Manual Wafer Mounter | TAM Series
The TAM Series Manual Wafer Mounter delivers highly precise, uniform tape application for semiconductor manufacturing and research environments. Engineered for versatility, the series includes the compact TAM-6800 (supporting 6″ to 8″ wafers) and the high-capacity TAM-1200 (supporting 8″ to 12″ wafers). Both systems feature an integrated vacuum chuck capable of reaching up to 90°C to guarantee bubble-free lamination and optimized tape adhesion across variable wafer thicknesses.
Designed to fit comfortably into cleanroom benches, the TAM Series balances a compact physical footprint with industrial-grade reliability. Operating on standard single-phase AC infrastructure and low pneumatic consumption (10 L/min), these manual mounters provide a stable, cost-effective solution for low-to-medium volume wafer processing without compromising on processing quality.
Key Advantages
- Flexible Wafer Handling: Seamlessly accommodates wafer sizes from 150mm up to 300mm across a wide variety of industry-standard tape frame formats.
- Thermal Precision: Features an adjustable vacuum table heating system up to 90°C to eliminate micro-bubbles and improve tape compliance.
- Efficient Infrastructure: Low-maintenance design utilizing simple pneumatic pressure (4.0–5.0 kgf/cm²+G) and standard AC 110V/220V electricity.
| Technical Specification | Model: TAM-6800 | Model: TAM-1200 |
|---|---|---|
| Wafer Capability Range | 6″ to 8″ (150mm to 200mm) | 8″ to 12″ (200mm to 300mm) |
| Compatible Tape Frame Formats | 2-6-1, 2-8-1, 2-10-1 | 2-8-1, 2-10-1, 2-12-1 |
| Maximum Vacuum Chuck Temperature | 90°C | 90°C |
| Electrical Infrastructure Requirements | Single Phase AC 110V / 220V | Single Phase AC 110V / 220V |
| Pneumatic Operating Pressure | 4.0 - 5.0 kgf/cm² +G | 4.0 - 5.0 kgf/cm² +G |
| Maximum Pneumatic Flow Consumption | 10 L/min (ANR) | 10 L/min (ANR) |
| Equipment Footprint (W x D x H) | 820 x 610 x 400 mm | 1000 x 610 x 500 mm |
| Net Equipment Weight | 30 kg | 40 kg |
Semi Auto Expander | TAE Series
The TAE Series Semi-Auto Expander provides an exceptionally precise and reliable solution for expanding diced wafers to facilitate seamless die sorting and picking. Built to adapt to diverse cleanroom workflows, the series spans across model tiers designed to accommodate standard wafer sizes from 4″ up to 12″ and matching frame sizes. Utilizing an advanced, human-machine interface (HMI) paired with automated safety overrides, the TAE Series maximizes process consistency while significantly eliminating human error and accidental product damage.
Unlike standard market alternatives that rely on less consistent drive mechanisms, the TAE Series employs a high-precision ball screw paired with a servo motor to drive the platform's ascent and descent. This configuration allows operators to completely customize expansion height and traveling speed, resulting in uniform tape stretching without risking die dislocation.
Key Features & Advantages
- Servo-Driven Precision Control: Driven by an integrated high-precision screw and servo motor system, ensuring ultra-exact adjustments to the platform’s ascent and descent speeds and height positions.
- Optical Sensing Fail-Safe: Equipped with advanced optical safety sensors that automatically halt subsequent actions if the grip frame or cover is misaligned, preventing operator injuries and protecting delicate wafers.
- Integrated Rotary Cutting: Includes a dedicated rotary knife cutting mechanism to ensure clean, precise tape separation following expansion sequences.
- Scalable Structural Footprint: Seamlessly handles everything from 4″ to 12″ wafer capacities (across T4 through T12 double ring configurations) within a compact, uniform W500 × L700 × H500 mm frame.
| Item | Models: TAE-T4-6 / T5-6 / T6-6 | Models: TAE-T7-8 / T8S-8 | Model: TAE-T12-12 |
|---|---|---|---|
| Wafer Size Capability | 4″ ~ 6″ | 4″ ~ 8″ | 4″ ~ 12″ |
| Tape Frame Size | 6″ | 8″ | 12″ |
| Compatible Double Ring | T4 / T5 / T6 | T7 / T8S | T12 |
| Dimensions (W x L x H) | 500 × 700 × 500 mm | ||
| Double Ring Item | Inner Ring (I.D. / O.D.) | Outer Ring (I.D. / O.D.) | Target Wafer Size |
|---|---|---|---|
| T-4 | 123 / 129 mm | 129 / 134 mm | 4″ |
| T-5 | 140 / 146 mm | 146 / 152 mm | 5″ |
| T-6 | 170 / 178 mm | 178 / 186 mm | 6″ |
| T-7 | 195 / 203 mm | 203 / 210 mm | 7″ |
| T-8S | 225 / 233 mm | 233 / 241 mm | 8″ |
| T12 | 325 / 335 mm | 335 / 345 mm | 12″ |
TAC Series Wafer Cleaner | CL Series
The TAC Series Wafer Cleaner delivers advanced, high-efficiency cleaning for wafer processing environments where substrate surface purity is critical. Engineered to remove microscopic contaminants and residual debris following dicing or grinding, this system ensures pristine wafer surfaces to safeguard subsequent downstream processes. Available in various models to match precise manufacturing lines, the series seamlessly accommodates standard wafer diameters up to 12″ (300mm) and their corresponding tape frame formats.
Designed to optimize structural cleanroom space, the TAC Series balances a compact physical footprint with industrial-grade reliability. Combining targeted chemical fluid delivery, precision mechanical action, and high-velocity spinning, the series ensures uniform residue removal across variable wafer topologies while maintaining high process safety and minimizing mechanical substrate stress.
Key Features & Advantages
- High-Efficiency Contaminant Removal: Specifically engineered to eliminate post-dicing debris, fine particles, and surface residues from delicate wafer structures.
- Optical Sensing Fail-Safe: Equipped with advanced optical safety sensors that automatically halt subsequent actions if the grip frame or cover is misaligned, preventing operator injuries and protecting delicate wafers.
- Integrated Rotary Cutting: Includes a dedicated rotary knife cutting mechanism to ensure clean, precise tape separation following expansion sequences.
- Scalable Structural Footprint: Seamlessly handles everything from 4″ to 12″ wafer capacities (across T4 through T12 double ring configurations) within a compact, uniform W500 × L700 × H500 mm frame.
| Feature / Item | Model: CL6801 | Model: CL1201 |
|---|---|---|
| Compatible Wafer Size | 6″ to 8″ | 6″ to 12″ |
| Tape Frame Formats | 2-6, 2-6-1, 2-8-1 | 2-6-1, 2-8-1, 2-10-1, 2-12-1 |
| High-Pressure Water System | 2 to 12 MPa | 2 to 12 MPa |
| Vacuum Chuck Rotation Speed | Up to 3,000 rpm (Max) | Up to 3,000 rpm (Max) |
| Power Supply | AC 110V / 220V | AC 110V / 220V |
| Air Consumption Utility | 6 kgf/cm² + G | 6 kgf/cm² + G |
| Maximum Air Flow Rate | Max. 100 L/min (ANR) | Max. 150 L/min (ANR) |
| Water Supply Pressure | 2 to 3 kgf/cm² | 2 to 3 kgf/cm² |
| Maximum Water Flow Rate | Max. 10 L/min | Max. 15 L/min |
| Nitrogen (N₂) Pressure | 4 to 5 kgf/cm² + G | 4 to 5 kgf/cm² + G |
| Maximum Nitrogen (N₂) Flow | Max. 100 L/min (ANR) | Max. 150 L/min (ANR) |
| Exhaust Suction (Minimum) | Min. 5.0 m³/min | Min. 5.0 m³/min |
| Physical Dimensions (W x D x H) | 850 x 450 x 1200 mm | 850 x 550 x 1200 mm |
| Net Weight | 90 kg | 120 kg |
TUV Series Manual UV Irradiator
The TUV-300 Series Manual UV Irradiator delivers highly uniform, controlled ultraviolet light exposure for semi-automatic and manual semiconductor backend processing lines. Specifically engineered to reduce tape adhesion after wafer dicing or back-grinding, this robust benchtop system effectively alters the chemical profile of UV-curable dicing tapes. By executing localized, uniform curing profiles, it ensures effortless, stress-free die shear and pickup without introducing unwanted thermal load or mechanical stress to fragile wafer topologies.
Designed with flexible structural scaling, the series seamlessly accommodates variable wafer and tape frame sizes ranging from 6″ to 12″. It integrates an intuitive 7-inch Human-Machine Interface (HMI) touch panel that allows operator teams to adjust precision irradiation cycles (ranging from 0.1 seconds up to 999.9 minutes) based on explicit product conditions.
Key Features & Advantages
- Flexible Light Source Architecture: Available in traditional high-efficiency UV lamp configurations or advanced energy-saving LED systems (TUV-300HL) utilizing 224 high-power 365nm LED pieces.
- Directional Irradiation Paths: Configurable to suit distinct cleanroom process steps, offering Top-down (TUV-300U), Bottom-up (TUV-300H), or concurrent Dual-sided (TUV-300DP) illumination vectors.
- Enhanced Curing Environment: Built-in nitrogen (N2) cooling and pathway systems isolate oxygen and lower surface temperatures to drastically enhance UV cross-linking efficiency while protecting temperature-sensitive substrates.
- Industrial Ergonomics: Features an quick-change tube system for fast lamp maintenance, an integrated magnetic floating exhaust setup, and an automated internal turnover system depending on the chosen fixture package.
| System Specification / Feature | TUV-300 Standard Line (Lamp Style) | TUV-300HL Line (High-Power LED) |
|---|---|---|
| Wafer Processing Range | 6″, 8″, 12″ (Interchangeable Glass Trays) | 6″, 8″, 12″ (Interchangeable Glass Trays) |
| Illumination Technology | High-Pressure Mercury / Halogen Lamp Line | 224-Piece High-Power LED Matrix (365nm) |
| Irradiation Vector Options | Top-Down (U Style) / Bottom-Up (H Style) / Dual-Sided (DP Style) | |
| Operator Control System | 7-Inch Color HMI Touch Panel Interface | 7-Inch Color HMI Touch Panel Interface |
| Timer Tuning Range | 0.1 seconds to 999.9 minutes | 0.1 seconds to 999.9 minutes |
| Electrical Input Requirement | Single-Phase AC 220V, 50/60 Hz | Single-Phase AC 220V, 50/60 Hz |
| Pneumatic Air Support | 4.0 to 5.0 kgf/cm² | 4.0 to 5.0 kgf/cm² |
| Nitrogen (N₂) Purge Path | Optional (For Enhanced Cross-Linking) | Integrated Standard (Oxygen Isolation & Cooling) |
| Structural System Safeguards | Anti-UV Observation Panel, Error Alarms, Safety Buzzers, Emergency Stop Switch | |
| Physical Footprint (W x D x H) | 530 x 645 x 430 mm | 550 x 645 x 430 mm |
| Net Structural Weight | Approx. 45 kg | Approx. 50 kg |
Our Semiconductor and PCB Films
Various Application and Customizations
Singulation Tape
Secures Chips During cutting; Offers precise UV release.
Backgrinding Film
Supports wafers during thinning; prevents breakage.
Heat Release Film
Supports package dicing; prevents breakage and residue Free.
Toyo Adtec Precision Pre-Cut Dicing Films: Streamline Your Singulation Process
Zero Airborne Contam andPerfect Frame Alignment Fit to customer needs.
Backgrind Tapes
Supports wafers during thinning; prevents breakage.
Polyimide Film
Paired with high-performance silicone or acrylic adhesives, it peels away perfectly clean after processing, leaving zero residue on precious gold contacts ("gold fingers").
Mylar Carrier Film
The ceramic dielectric slurry is coated directly onto the moving PET film via a doctor blade or die coater. The film must be completely uniform to prevent thickness variations with custom Length and Width per custoner needs,
Die Attach Film
Die Attach Film is adhesive film which is used for semiconductor process. Optimized dicing tape for Die Attach Film achieves excellent pick up performance