Wafer Protection

Tapes for Backgrinding

UV & Non-UV Release

Primary App: Silicon Wafers

Suitable for thin wafers and etching. Prevents warpage and offers easier detaping. Silicone-free options available.

Series	SP, CP Series
Backing	100–420µm
Adhesive	5–130µm

Wafer Singulation

Tapes for Dicing

UV Release

Primary App: Compound & Package

Reduces chipping with strong adhesion before UV and easy peel-off after. Antistatic options available to prevent whiskers.

Series	UC, FC Series
Backing	80–150µm
Adhesive	5–20µm

Combined Process

Dicing Die Attach Film

UV Type + Heat Cure

Primary App: Die Attach & Dicing

Excellent pick-up performance supporting both blade and stealth laser dicing. Features high die-shear strength.

Series	AFN Series
DAF Thick.	10–80µm
DC Tape	100µm

Temporary Hold

Heat Release Tape

Thermal Release (110–140°C)

Primary App: Chips, LCDs, LEDs

Strong room-temperature adhesion (>800 g/inch). Releases automatically in under 1 minute when heated. Leaves zero residue.

Series	TR-120 Series
Total Thick.	115–255µm
Adhesive	40µm

Surface Protection

Mylar Film

MLCC Carrier Film

Primary App: Screens & Optics

Highly transparent PET with low adhesion for easy, manual rework. Anti-static and heat-resistant configurations available.

Series	PF-PET Series
Total Thick.	87–135µm
Adhesive	10–12µm (Acrylic)

Extreme Environment

Polyimide Film Tapes

Pressure Sensitive

Primary App: EV, Motors, Aerospace

Permanent/semi-permanent insulation resisting up to 300°C (short-term). UL94 V-0 flame retardant with high dielectric strength.

Series	CHR Series
Shrinkage	<1%
Adhesive	Silicone / Acrylic