Advanced Vision Inspection & High-Speed Handling Solutions
Discover Pentamaster's industry-leading back-end automated vision solutions engineered to move semiconductor lines closer to zero-defect production. Covering high-throughput turret configurations, premium 360-degree glass handling mechanisms, and precise reel-to-reel post-seal parameters, these suites provide uncompromising defect filtering across diverse package form-factors.
Our Semiconductor and PCB Films
Various Application and Customizations
Singulation Tape
Secures Chips During cutting; Offers precise UV release.
Backgrinding Film
Supports wafers during thinning; prevents breakage.
Heat Release Film
Supports package dicing; prevents breakage and residue Free.
Toyo Adtec Precision Pre-Cut Dicing Films: Streamline Your Singulation Process
Zero Airborne Contam andPerfect Frame Alignment Fit to customer needs.
Backgrind Tapes
Supports wafers during thinning; prevents breakage.
Polyimide Film
Paired with high-performance silicone or acrylic adhesives, it peels away perfectly clean after processing, leaving zero residue on precious gold contacts ("gold fingers").
Mylar Carrier Film
The ceramic dielectric slurry is coated directly onto the moving PET film via a doctor blade or die coater. The film must be completely uniform to prevent thickness variations with custom Length and Width per custoner needs,
Die Attach Film
Die Attach Film is adhesive film which is used for semiconductor process. Optimized dicing tape for Die Attach Film achieves excellent pick up performance
