High-Precision Dicing & Singulation Solutions
Our complete portfolio of semiconductor dicing saws, advanced contactless laser systems, and automated auxiliary tools delivers high-yield processing for modern semiconductor packaging lines. From manual 6-inch tools up to 12-inch fully automated dual-axis flagship systems, our equipment ensures sub-micron accuracy, efficient particle removal, and damage-free substrate separation.
JCA Advanced | Precision Singulation Matrix
Interactive configuration tool for Jingchuang (JCA) mechanical wheel dicing and laser stealth sawing platforms.
Spindle & Tooling Parameters
Engineered with high-rigidity air bearing setups and closed-loop position monitoring arrays to control chipping tolerances down to micro-levels.
Application Spectrum
Tailored directly for precision processing of structured wafer substrates, complex integrated micro-circuits, and thin silicon layouts.
Laser Singulation Platforms
Contactless solutions optimized for ultra-thin wafers, fragile compounds, and highly condensed street sizes where traditional mechanical blades risk micro-cracking or delamination.
ALR4000 System
Specialized laser processing and grooving/dicing saw platform. Offers exceptional thermal control to achieve completely clean, precise material ablation along ultra-narrow kerf paths.
FLR Laser Platform
Advanced multi-functional laser ablation and singulation center. Purpose-built for complex compound substrates, micro-machining, and high-density semiconductor architectures requiring zero mechanical stress.
Auxiliary Work Cell Equipment
Essential wafer preparation and post-processing modules that manage the environment before and after singulation to protect overall package yields and die integrity.
Tell Us Your Requirement
Looking for custom singulation configurations, blade parameters, or technical integration options?
Our Semiconductor and PCB Films
Various Application and Customizations
Singulation Tape
Secures Chips During cutting; Offers precise UV release.
Backgrinding Film
Supports wafers during thinning; prevents breakage.
Heat Release Film
Supports package dicing; prevents breakage and residue Free.
Toyo Adtec Precision Pre-Cut Dicing Films: Streamline Your Singulation Process
Zero Airborne Contam andPerfect Frame Alignment Fit to customer needs.
Backgrind Tapes
Supports wafers during thinning; prevents breakage.
Polyimide Film
Paired with high-performance silicone or acrylic adhesives, it peels away perfectly clean after processing, leaving zero residue on precious gold contacts ("gold fingers").
Mylar Carrier Film
The ceramic dielectric slurry is coated directly onto the moving PET film via a doctor blade or die coater. The film must be completely uniform to prevent thickness variations with custom Length and Width per custoner needs,
Die Attach Film
Die Attach Film is adhesive film which is used for semiconductor process. Optimized dicing tape for Die Attach Film achieves excellent pick up performance