Toyo Adtec Dicing | Singulation Blades
Super Hubless Dicing Blade with resin, metal and nickel matrices. The dicing blades are manufactured by specialty consolidation, sintering and electro-forming processes that improve the uniformity of the thin blades. They are suitable for cutting ceramics, brittle materials, optical glass, and printed circuit boards, especially for semiconductor packaging.
Diamond Hubless Blade also available.
Superabrasive Dicing Blades
An engineering guide matching substrate dynamics with precision micro-machining diamond matrices.
■ Dynamic Selection Calculator
Engineered Configuration Result:
Electroformed Nickel Bond (Hubbed)
Recommended Blade Thickness: 0.020 - 0.035 mm
Ideal Grit Matrix: 2 - 4 µm (#4000 Mesh)
■ Mechanical Geometry Anatomy
Abrasive Outer Rim (OD)
Supporting Rigid Hub
Arbor/Bore Hole (ID)
■ Substrate & Bond Cross-Reference Matrix
| Material Family | Recommended Bond | Core Mechanical Benefit | Chipping Risk Control |
|---|---|---|---|
| Silicon Wafers | Electroplated Nickel | High exposure of diamond tips ensures cold cutting action | Excellent finish; ultra-low micro-chipping tracking |
| Sapphire / SiC | Extreme abrasive wear resistance against ultra-hard materials | Moderate; requires highly precise, slowed feed-rate inputs | |
| Glass / Quartz / Crystals | Resin Compound | High elastic elasticity index minimizes brittle vibration transfer | Very Low; prevents micro-fracture line propagation |
| Advanced Packaging (EMC) | Low Conc. Nickel | Open structure resists loading/clogging from resin dust | Low; handles dual-stage composite material interfaces |
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