Dicing and Backgrinding Tapes
Toyo Adtec offers tapes for Wafer/Substrate Dicing and Backgrinding processes. Base Films can be user-defined as PVC, EVA or PO material. Adhesives are available as pressure-sensitive acrylic or UV-type. Depending on customer requirements, these tapes can be supplied in rolls, cut sheets or in custom pre-cut modes.
High Temp UV Tape
Toyo Adtec UV tape is specifically designed for dicing Packages or LED modules. It maintains strong adhesion during dicing and excellent release performance after UV Exposure. Adhesive design allows for post-dicing expansion while preventing contamination and adhesive residue. The tape also can be used in high temperature processes. Available in Pre-Cut and Roll Types.