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Toyo Adtec offers Stamped Lead frames for Power, IC, and Discreet Packages.
With an extensive selection of Open Tools to choose from, we guarantee the most cost-effective lead frames in the industry. Delivery cycle time is also one of the shortest, even for custom-designs.
Silver Alloy Wire
gold prices become impossible to control, companies have looked to copper as a replacement for Au wire. Silver Alloy wire is softer than Copper. A composite of Ag-Au-Pd, silver alloy possesses similar mechanical and bond-ability properties as Au, and is significantly lower in cost. While this Alloy Wire, machine UPH, yield and reliability are comparable to Au Wire.
Ceramic Substrate and Tubes
DBC (Direct-bonded Copper) ceramic substrate is essential for the latest Power Modules. Toyo Adtec offers a variety of DBC materials such as Alumina and AlN to achieve the required impact strength, heat resistance and thermal conductivity.
Die Attach Paste
DA Paste remains a major cost contributor to Semiconductor packages.
Establish an alternative source of high reliability paste which offers greater cost advantages. Toyo Adtec offers a wide range of material properties to suit your process requirements, such as viscosity and moisture absorption.